LAM Research 810‑800256‑207 Chamber Node Board Assembly (Rev.B / Rev.E) for Semiconductor Etch Equipment
LAM Research 810‑800256‑207 Chamber Node Board Assembly (Rev.B / Rev.E) for Semiconductor Etch Equipment - Image 2
LAM Research 810‑800256‑207 Chamber Node Board Assembly (Rev.B / Rev.E) for Semiconductor Etch Equipment - Image 3

LAM Research 810‑800256‑207 Chamber Node Board Assembly (Rev.B / Rev.E) for Semiconductor Etch Equipment

  1. 810‑800256‑107
  2. 810‑028295‑173
  3. 810‑802902‑026
  4. 853‑049542‑173
  5. 0190‑13298
  6. 810‑800256‑307
  7. 810‑100446‑001

 

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Description

LAM Research 810‑800256‑207 Chamber Node Board Assembly (Rev.B / Rev.E) for Semiconductor Etch Equipment

 

Product Details

The 810‑800256‑207 is a chamber‑level node control board assembly manufactured by LAM Research, used on LAM dielectric etch semiconductor processing platforms. Origin: USA. Lifecycle status: EOL discontinued, original factory no longer produces new units; market supply consists of NOS surplus stock and fully tested refurbished assemblies for fab equipment maintenance.

This integrated node board undertakes local chamber I/O handling, safety interlock logic execution, sensor signal acquisition, valve‑actuator drive control and serial‑bus communication with tool main controller. It carries multi‑channel digital input/output, analog signal conditioning circuits, onboard flash memory for chamber configuration and fault log storage. Multiple hardware revision levels exist: Rev.B, Rev.E are common commercial revisions, revisions are not cross‑compatible in many chamber configurations. Installed inside process chamber electronics bay, powered by 24 VDC.

 

Applications

‑ LAM Research semiconductor dielectric etch tool chamber local node control ‑ Wafer fab etch equipment spare‑part replacement ‑ Semiconductor fabrication facility legacy process‑chamber maintenance & refurbishment ‑ Chamber safety interlock and local I/O signal processing ‑ Equipment upgrade and component swap for existing LAM etch systems ‑ Spare inventory for semiconductor equipment maintenance department

LAM 810-800256-207

Related Series Models (6+)

  1. 810‑800256‑107
  2. 810‑028295‑173
  3. 810‑802902‑026
  4. 853‑049542‑173
  5. 0190‑13298
  6. 810‑800256‑307
  7. 810‑100446‑001

 

Key Features

  1. Dedicated chamber node board assembly for LAM etch semiconductor equipment, performs local I/O and interlock control.
  2. On‑board digital / analog signal conditioning, stores chamber hardware configuration and fault event logs.
  3. Implements chamber safety interlock logic, prevents unsafe equipment operation status.
  4. Serial bus interface for bidirectional communication with the tool host main controller.
  5. Multiple hardware revisions (Rev.B, Rev.E); revision compatibility must be verified before field replacement.
  6. 24 VDC cabinet power supply, compact assembly form for chamber electronics‑bay installation.
  7. Built‑in hardware self‑diagnosis for signal channels, power status and communication faults.
  8. Manufactured in USA, OEM proprietary assembly, EOL obsolete, supplied as NOS or tested refurbished spare‑parts.

 

Main Functions

  1. Execute chamber‑level local safety interlock logic for LAM etch process chamber.
  2. Collect feedback signals from field sensors, limit switches, pressure and temperature transducers.
  3. Output drive control commands to chamber solenoid valves and actuators.
  4. Store chamber‑specific configuration parameters and runtime fault logs for maintenance traceability.
  5. Realize data exchange with upper‑level tool main controller via dedicated serial bus.
  6. Continuously monitor hardware health status, trigger safety interlock protection under abnormal conditions.
  7. Detect channel faults and report diagnostic alarms to equipment host for operator warning.
  8. Serve as local node control assembly for etch chamber to guarantee normal semiconductor wafer‑processing sequence.

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